장비검색/예약
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- 장비활용
- 장비검색/예약
정보제공 : ZEUS 장비활용종합포털(www.zeus.go.kr)
광절연막 제거 장비
Laser Lift-Off (LLO)
| GBTP No. | GBREMS-18-0068 |
|---|---|
| NFEC등록번호 | NFEC-2013-11-184015 |
| I-tube등록번호 | 1307-C-0129 |
| 보유기관 | 영남대학교 산학협력단 |
| 연락처 | 053-810-2344 |
| 대표번호 | - |
장비정보
| 모델명 | ELMS-1000 | 제작사 | 큐엠씨 |
|---|---|---|---|
| 취득일자 | 2014-09-22 | 취득금액 | 522,000,000원 |
| 표준분류 | 기계가공/시험장비 > 반도체장비 > 가공/리페어/절단장비 | 활용용도 | 시험 |
| 장비위치 |
경상북도 경산시 대학로 280 (대동) 214-1번지 영남대학교 CRC F1층 클린룸(102)
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| 장비설명 |
1. Laser Lift-Off (LLO) provides a way to separate the GaN layer from sapphire/SiC
substrate. 2. GaN based LED dies can be debonded from the substrate and the energy density be chosen to meet the optimum debonding conditions. |
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| 구성 및 기능 |
1. Material: GaN on Sapphire/SiC substrate etc
2. Full Automatic Operation System - Automatic wafer alignment laser beam focusing wafer loading/unloading System 3. Laser System - Type: 248nm KrF excimer laser (Cohearent 社) - Pulse energy: Max. >600mJ - Energy stability: 1%@2o 4. Working Stage System 1) X-Y axis: Up to 6 inch wafer 2) Z axis: 15mm or more 3) Theta(8) axis: 30 degrees or more 4) Flatness: < :t 10um in 6 inch area 5) Wafer chuck: Special vacuum chuck for uniform holding force across wafer 5. Beam Delivery System 1) Beam delivery support structure - Vibration isolating mounting platform for 3 axes stages and beam delivery optics 2) Purging system - N2 purged beam delivery system for best laser beam transmission and longer life time of optics 3) Beam size: Max. 3 x 3mm2 4) Inhomogeneity: <:t5%@2o 6. Vision System 1) Process monitoring camera: Zoom vision system Optical magnification CCD camera 2) Alignment and inspection camera: Monitoring system with energy meter on the wafer stage Beam profiler on mask |
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